Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11191187 | Electronic assembly with phase-change material for thermal performance | Andrew Schefter, William F. Cooper | 2021-11-30 | $141,886,000 |
| 11128062 | Electronic assembly with a direct current bus connection | — | 2021-09-21 | |
| 11006513 | Electronic assembly having sectional thermal management | — | 2021-05-11 | $106,914,000 |