MR

Michael Ras

DL Ddp Specialty Electronic Materials Us, Llc.: 1 patents #20 of 66Top 35%
Overall (2021): #329,064 of 548,734Top 60%
1
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11173672 Method for bonding using one-component epoxy adhesive mixtures Andreas Lutz, Daniel Schneider, Irene Maeder, Marcel Aschwanden 2021-11-16