Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11170070 | Sparse component analysis method for structural modal identification when the number of sensors is incomplete | Tinghua YI, Hongnan LI | 2021-11-09 |
| 10885146 | Modal identification method for non-proportionally damped structures based on extended sparse component analysis | Tinghua YI, Chunxu QU, Hongnan LI | 2021-01-05 |