Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201095 | Chip package having a cover with window | Ronilo Boja, Inderjit Singh, Gerilyn Maloney | 2021-12-14 |
| 11156764 | Bonded optical systems and applications thereof | Claudio Girotto, Theodore Lowes, Mark Youmans | 2021-10-26 |