Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088010 | Temporary bonding method with thermoplastic adhesive incorporating a rigid ring | Pierre Montmeat, Marc Zussy | 2021-08-10 |
| 11081463 | Bonding method with electron-stimulated desorption | Vincent Larrey, Sylvain Maitrejean, Christophe Morales | 2021-08-03 |
| 11054402 | Method and device for checking a bond between two substrates | Ali Dekious, Emilie DELOFFRE, Gilles Despaux, Vincent Larrey, Emmanuel Le Clezio | 2021-07-06 |
| 11056340 | Direct bonding process | Frédéric Mazen | 2021-07-06 |
| 10957539 | Method for bonding by direct adhesion | Vincent Larrey, Christophe Morales, Marwan Tedjini | 2021-03-23 |
| 10884187 | Method for the collective production of a plurality of optoelectronic chips | Sylvie Menezo | 2021-01-05 |