Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011490 | Assembly comprising hybrid interconnecting means including intermediate interconnecting elements and sintered metal joints, and manufacturing process | Rabih KHAZAKA | 2021-05-18 |
| 10957639 | Electronic component having a transistor and interdigitated fingers to form at least a portion of a capacitive component within the electronic component | Thibault Catelain | 2021-03-23 |