Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11184984 | Solder printing inspection device, solder printing inspection method and method of manufacturing substrate | Manabu Okuda, Tsuyoshi Ohyama | 2021-11-23 |
| 11039561 | Component mounting system and adhesive inspection device | Ikuo Futamura, Tsuyoshi Ohyama, Kazuyoshi Kikuchi | 2021-06-15 |
| 10926907 | PTP packaging machine | Shunji Maruyama, Tsuyoshi Ohyama | 2021-02-23 |
| 10914574 | Three-dimensional measurement device | Nobuyuki Umemura, Tsuyoshi Ohyama | 2021-02-09 |