| 1 |
Andrew Huska |
Rohinni |
10 |
| 2 |
Tahir Cader |
Hewlett Packard Enterprise |
8 |
| 3 |
Rodney G. Schneidmiller |
Sterling International |
4 |
| #4 |
Robert Bruce Wagstaff |
Novelis |
3 |
| #4 |
Jerrald Barsten |
— |
3 |
| #4 |
Rich Lee |
Infinitum Electric |
3 |
| #4 |
Sean Kupcow |
Rohinni |
3 |
| #8 |
Christopher Morton Lee |
Corning Incorporated |
2 |
| #8 |
Bryon S. Bridges |
Schweitzer Engineering Laboratories |
2 |
| #8 |
David Michael Smead |
Telect |
2 |
| #11 |
Brett L. Carter |
IBM |
1 |
| #11 |
Eric Wellington |
Advanced Concepts In Manufacturing |
1 |
| #11 |
Richard Donald Maes, II |
Itron |
1 |
| #11 |
Steven Kyle Witkoe |
Telect |
1 |
| #11 |
Mitchell Williams |
Apple |
1 |
| #11 |
Mitchell G. Lawrence |
Apple |
1 |
| #11 |
Jerad Park |
Infinitum Electric |
1 |
| #11 |
Stephane Hyvernat |
Itron Global Sarl |
1 |
| #11 |
Timothy McBrien Turpin |
Telect |
1 |
| #11 |
Jacob Andersen |
Unomedical A/S |
1 |
| #11 |
Craig Richard Cordill |
Wagstaff |
1 |
| #11 |
Spencer Williams |
Telect |
1 |
| #11 |
Ravi Rastogi |
Senseonics, Incorporated |
1 |
| #11 |
Jonathan Thatcher |
Fusion-Io |
1 |
| #11 |
Greg Grankowski |
Zak Designs |
1 |
| #11 |
Derick Charles Baker |
Pearson Packaging Systems |
1 |