Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11116096 | Medium for binding components in an assembly of an electronic device, a method of preparing the same, a display assembly of an electronic device, and a system for simulating mechanical behaviours of the electronic device and the medium | Bo Xu | 2021-09-07 |
| 11065864 | Hybrid polymeric structure, a method for fabricating a hybrid polymeric structure and a method for connecting two polymeric layers with the hybrid polymeric structure | Yuexing Zhan, Yan Ting Chan, Tsz Ling Wong, Tak Mei Yiu | 2021-07-20 |