Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171786 | Chained trusted platform modules (TPMs) as a secure bus for pre-placement of device capabilities | Eric Voit, David C. Lapier, William F. Sulzen | 2021-11-09 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171786 | Chained trusted platform modules (TPMs) as a secure bus for pre-placement of device capabilities | Eric Voit, David C. Lapier, William F. Sulzen | 2021-11-09 |