Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923621 | Method for reduction of interfacial stress accumulation between double side copper-plated layers and aluminum nitride substrate | Chun-Te Wu, Yang-Kuo Kuo, Cheng-Hung Shih | 2021-02-16 |