WC

Wen-Fu Chou

CT Chipbond Technology: 2 patents #1 of 14Top 8%
Overall (2021): #100,636 of 548,734Top 20%
2
Patents 2021

Issued Patents 2021

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10999928 Circuit board Yu Ma, Hsin-Hao Huang, Gwo-Shyan Sheu 2021-05-04
10993319 Chip package and circuit board thereof Yu Ma, Hsin-Hao Huang, Gwo-Shyan Sheu 2021-04-27