ZG

Zhiming Geng

CC China Wafer Level Csp Co.: 1 patents #1 of 2Top 50%
Overall (2021): #189,887 of 548,734Top 35%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11049899 Encapsulation structure of image sensing chip, and encapsulation method therefor Zhiqi Wang 2021-06-29