Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205601 | Semiconductor package and semiconductor apparatus | Eung Chang Lee, Heeyoub Kang, Haejung Yang, Youngrok Oh, Kitaek Lee | 2021-12-21 |
| 11136457 | Thermoplastic resin composition and article produced therefrom | Young Mi Kim, Nam Hyun Kim, Sang Hyun Hong | 2021-10-05 |
| 11078360 | Polycarbonate/polycarbonate-polysiloxane composition | Nam Hyun Kim, Young Mi Kim, Sang Hyun Hong | 2021-08-03 |