Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114417 | Through-silicon via (TSV) test circuit, TSV test method and integrated circuits (IC) chip | — | 2021-09-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114417 | Through-silicon via (TSV) test circuit, TSV test method and integrated circuits (IC) chip | — | 2021-09-07 |