Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201137 | Systems and methods for powering an integrated circuit having multiple interconnected die | — | 2021-12-14 |
| 11145530 | System and method for alignment of an integrated circuit | Tim Botsford, Philip Ferolito, Paul Kennedy | 2021-10-12 |
| 10971401 | Systems and methods for precision fabrication of an orifice within an integrated circuit | — | 2021-04-06 |
| 10957595 | Systems and methods for precision fabrication of an orifice within an integrated circuit | — | 2021-03-23 |
| 10923456 | Systems and methods for hierarchical exposure of an integrated circuit having multiple interconnected die | — | 2021-02-16 |
| 10923412 | Apparatuses and methods for implementing a sliding thermal interface between substrates with varying coefficients of thermal expansion | — | 2021-02-16 |
| 10892244 | Apparatus and method for securing substrates with varying coefficients of thermal expansion | — | 2021-01-12 |