Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11182929 | Methods and systems for compressing shape data for electronic designs | Ajay Baranwal, Michael Meyer | 2021-11-23 |
| 11096271 | Double-sided, high-density network fabrication | Brian Atwood, Sankerlingam Rajendran, Douglas R. Gentry, Walter B. Aschenbeck, Jr. | 2021-08-17 |