Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094566 | Substrate heating apparatus including heater under substrate support and substrate processing apparatus using the same | — | 2021-08-17 |
| 11020887 | Resin molding method | Yukuo Yamaguchi, Mikiya Umeyama, Hiromasa Amma, Takuya Iwano, Satoshi Kimura +3 more | 2021-06-01 |
| 10926441 | Liquid supply member and manufacturing method of liquid supply member | Naoko Tsujiuchi, Yukuo Yamaguchi, Mikiya Umeyama, Hiromasa Amma, Takuya Iwano +3 more | 2021-02-23 |
| 10906221 | Manufacturing method of liquid supply member | Naoko Tsujiuchi, Yukuo Yamaguchi, Mikiya Umeyama, Hiromasa Amma, Takuya Iwano +3 more | 2021-02-02 |