Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145589 | Semiconductor module bonding structure and bonding method | Naohisa Harada, Kyosuke Ishikawa, Atsushi Kawade | 2021-10-12 |
| 10944913 | Imaging element, imaging device, and control method | — | 2021-03-09 |