Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114310 | Embedded packaging method capable of realizing heat dissipation | Xianming Chen, Wenshi Wang, Weiyuan YANG, Benxia HUANG, Lei Feng | 2021-09-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114310 | Embedded packaging method capable of realizing heat dissipation | Xianming Chen, Wenshi Wang, Weiyuan YANG, Benxia HUANG, Lei Feng | 2021-09-07 |