Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049829 | Redistribution metal and under bump metal interconnect structures and method | Sam Ziqun Zhao, Liming Tsau, Andy Brotman | 2021-06-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049829 | Redistribution metal and under bump metal interconnect structures and method | Sam Ziqun Zhao, Liming Tsau, Andy Brotman | 2021-06-29 |