Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10968348 | Laser-releasable bonding materials for 3-D IC applications | Xiao Liu, Qi Wu, Rama Puligadda, Dongshun Bai | 2021-04-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10968348 | Laser-releasable bonding materials for 3-D IC applications | Xiao Liu, Qi Wu, Rama Puligadda, Dongshun Bai | 2021-04-06 |