Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139217 | Post-production substrate modification with FIB deposition | Jeffrey Zimmerman, Richard J. Ferguson | 2021-10-05 |
| 10998890 | Radiation-hardened D flip-flop circuit | Bin Li, David Bostedo, Nicholas J. Chiolino, Patrick Fleming, David D. Moser | 2021-05-04 |