Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11212922 | Circuit board and manufacturing method thereof | XIAN-QIN HU, FU-YUN SHEN, HSIAO-TING HSU, Yong-Chao Wei | 2021-12-28 |
| 11134564 | Transparent PCB and method for manufacturing the same | HSIAO-TING HSU, FU-YUN SHEN, LI-KUN LIU | 2021-09-28 |
| 11051404 | Method for connecting stacked circuits boards | RUI-WU LIU, Man-Zhi Peng | 2021-06-29 |
| 10923411 | Method for manufacturing an ultrathin heat dissipation structure | Ning Hou, Cong Lei, Biao Li | 2021-02-16 |
| 10910300 | Method for manufacturing interposer | Man-Zhi Peng, RUI-WU LIU | 2021-02-02 |
| 10894882 | Low dielectric resin composition, film and circuit board using the same | SZU-HSIANG SU, SHOU-JUI HSIANG, Mao-Feng Hsu | 2021-01-19 |