Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10901935 | IC, bus system and control method thereof | Chih-Hung Huang, Chun-Wei Chiu | 2021-01-26 |
| 10903136 | Package structure having a plurality of insulating layers | Chi-Fu Wu, An-Ping Tseng, Hao Wu | 2021-01-26 |