Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11172572 | Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module | Ernest Clyde Parker | 2021-11-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11172572 | Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module | Ernest Clyde Parker | 2021-11-09 |