Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11032914 | Method of forming a solderable solder deposit on a contact pad | Kai-Jens Matejat, Sven Lamprecht, Jan SPERLING | 2021-06-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11032914 | Method of forming a solderable solder deposit on a contact pad | Kai-Jens Matejat, Sven Lamprecht, Jan SPERLING | 2021-06-08 |