Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145620 | Formation of bonding wire vertical interconnects | Jiang Huang, Ya Ping Zhu, Chi Kwan Park, Keng Yew SONG | 2021-10-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145620 | Formation of bonding wire vertical interconnects | Jiang Huang, Ya Ping Zhu, Chi Kwan Park, Keng Yew SONG | 2021-10-12 |