Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11136202 | Direct transfer apparatus for electronic components | Kai Siu LAM, Yen Hsi Tang, Hung Kit Chan, Ka Yee Mak | 2021-10-05 |
| 11056377 | Collet inspection in a semiconductor pick and place apparatus | Kai Siu LAM, Cheuk Ki Tam, Nim Tak WONG, Ka Yee Mak | 2021-07-06 |
| 10882298 | System for adjusting relative positions between components of a bonding apparatus | Shui Cheung Woo, Liang Tang, Wan Yin YAU, Wai Yuen Cheung | 2021-01-05 |