Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10960583 | Molding system for applying a uniform clamping pressure onto a substrate | Shu Chuen Ho, Chin Guan Ong, Kai WU, Teng Hock Kuah, Ji Hao | 2021-03-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10960583 | Molding system for applying a uniform clamping pressure onto a substrate | Shu Chuen Ho, Chin Guan Ong, Kai WU, Teng Hock Kuah, Ji Hao | 2021-03-30 |