Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211252 | Systems and methods for copper (I) suppression in electrochemical deposition | Eric J. Bergman, You Wang | 2021-12-28 |
| 10971354 | Drying high aspect ratio features | Eric J. Bergman, Paul R. McHugh, Stuart Crane, Richard W. Plavidal | 2021-04-06 |