Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11207795 | Mold materials for formed ceramic | Jeffrey Lee Mattlin, Abhijeet Misra, Herng-Jeng Jou, James A. Wright, James A. Yurko +2 more | 2021-12-28 |
| 11111594 | Processes to reduce interfacial enrichment of alloying elements under anodic oxide films and improve anodized appearance of heat treatable alloys | James A. Curran, Eric W. Hamann | 2021-09-07 |
| 10915151 | Multi-part device enclosure | Mikael Silvanto, Simon J. Trivett, Matthew Theobald, Dinesh C. Mathew, Simon R. Lancaster-Larocque +13 more | 2021-02-09 |