Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10953433 | Method for smoothing substrate surface | William F. Leggett, Ming Kun Shi, Simon R. Lancaster-Larocque | 2021-03-23 |
| 10897825 | Multi-part electronic device housing having contiguous filled surface | Ming Kun Shi, Lindsay D. Corbet, Collin D. Chan | 2021-01-19 |