CH

Chin-Wei Hsu

ME Mediatek: 1 patents #154 of 426Top 40%
NU National Tsing Hua University: 1 patents #16 of 166Top 10%
📍 Hsinchu, MI: #4 of 8 inventorsTop 50%
Overall (2021): #173,535 of 548,734Top 35%
2
Patents 2021

Issued Patents 2021

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11098407 Method for no-silane electroless metal deposition using high adhesive catalyst and product therefrom Wei Wang, Tzu-Chien Wei 2021-08-24
10979975 Method and apparatus for maintaining radio resource control connection in mobile communications Jia-Shi Lin, Yu Yao, Shih-Chieh Liao 2021-04-13