Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10980127 | Methods for fabricating printed circuit board assemblies with high density via array | Michael Len, Chong Mei, Raj Kumar | 2021-04-13 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10980127 | Methods for fabricating printed circuit board assemblies with high density via array | Michael Len, Chong Mei, Raj Kumar | 2021-04-13 |