Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903190 | Semiconductor package using a coreless signal distribution structure | Do Hyung Kim, Jung Soo Park | 2021-01-26 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903190 | Semiconductor package using a coreless signal distribution structure | Do Hyung Kim, Jung Soo Park | 2021-01-26 |