Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121102 | Semiconductor package and manufacturing method thereof | No Sun Park | 2021-09-14 |
| 11101144 | Semiconductor device and manufacturing method thereof | Doo Hyun Park, Seong Min Seo, Sung Geun Kang, Yong Seon Song, Wang Gu Lee +3 more | 2021-08-24 |
| 11043464 | Semiconductor device having upper and lower redistribution layers | Doo Hyun Park | 2021-06-22 |
| 10985031 | Semiconductor device and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Ji Hun Lee, Seong Min Seo | 2021-04-20 |
| 10903181 | Wafer level fan out semiconductor device and manufacturing method thereof | Boo Yang Jung, Choon Heung Lee, In Bae Park, Sang Won Kim, Sung Kyu Kim +1 more | 2021-01-26 |