Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121071 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dae Byoung Kang, Chel Woo Park | 2021-09-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121071 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dae Byoung Kang, Chel Woo Park | 2021-09-14 |