Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183414 | Secondary packaging method and secondary package of through silicon via chip | Baoquan WU, Yuping LIU | 2021-11-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183414 | Secondary packaging method and secondary package of through silicon via chip | Baoquan WU, Yuping LIU | 2021-11-23 |