Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189486 | Method for depositing an insulating material into a via | Fabien Piallat | 2021-11-30 |
| 11114340 | Method for producing an interconnection comprising a via extending through a substrate | Fabien Piallat | 2021-09-07 |