LS

Lei Shi

TC Tongfu Microelectronics Co.: 5 patents #1 of 1Top 100%
Huawei: 3 patents #525 of 3,447Top 20%
AV Abb Vie: 2 patents #17 of 63Top 30%
BC Baoshan Iron & Steel Co.: 2 patents #2 of 84Top 3%
Futurewei Technologies: 2 patents #28 of 245Top 15%
LC Lite-On Technology (Chang Zhou) Co.: 2 patents #1 of 7Top 15%
SA Siemens Aktiengesellschaft: 2 patents #58 of 874Top 7%
SN Smith & Nephew: 2 patents #22 of 230Top 10%
HC Hefei Xinsheng Optoelectronics Technology Co.: 1 patents #212 of 419Top 55%
HC Hisense Visual Technology Co.: 1 patents #9 of 62Top 15%
UK University Of Hong Kong: 1 patents #4 of 49Top 9%
LC Littelfuse Semiconductor (Wuxi) Co.: 1 patents #1 of 6Top 20%
MT Monsanto Technology: 1 patents #121 of 361Top 35%
BO BOE: 1 patents #1,593 of 3,191Top 50%
Xiaomi: 1 patents #148 of 414Top 40%
CU Cornell University: 1 patents #58 of 341Top 20%
FS Firmenich Sa: 1 patents #14 of 78Top 20%
CS Calico Life Sciences: 1 patents #1 of 12Top 9%
📍 Beijing, TX: #2 of 113 inventorsTop 2%
Overall (2021): #796 of 548,734Top 1%
30
Patents 2021

Issued Patents 2021

Showing 26–30 of 30 patents

Patent #TitleCo-InventorsDate
10913727 Modulators of the integrated stress pathway Marina Pliushchev, Jennifer M. Frost, Lawrence A. Black, Xiangdong Xu, Ramzi F. Sweis +5 more 2021-02-09
10910343 Package structure with improvement layer and fabrication method thereof 2021-02-02
10900050 Herbicide tolerance genes and methods of use thereof Christine M. Ellis, Artem G. Evdokimov, Paul C. C. Feng, Xiaoran Fu, Clayton T. Larue +3 more 2021-01-26
10903758 Hybrid multilevel inverters with reduced voltage stress Dianbo Fu, Zhaohui Wang 2021-01-26
10886194 Radiator component and heat dissipation system for power semiconductor device Sheng Zhang, Ji Long Yao, Yan Zhao, Ze Liu 2021-01-05