Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10883185 | Copper electrodeposition solution and process for high aspect ratio patterns | Laurianne Religieux, Mikailou THIAM | 2021-01-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10883185 | Copper electrodeposition solution and process for high aspect ratio patterns | Laurianne Religieux, Mikailou THIAM | 2021-01-05 |