Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158560 | Thermal structures for dissipating heat and methods for manufacture thereof | Rocco LUPOI | 2021-10-26 |
| 11032942 | Structure for a heat transfer interface and method of manufacturing the same | Roger Scott Kempers, Paul B. Ahern, Alan Michael Lyons | 2021-06-08 |