Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101052 | Conductive material, connection structure and method for producing connection structure | Sayaka Wakioka, Hidefumi Yasui, Shuujirou Sadanaga, Shike Sou, Yuta Yamanaka | 2021-08-24 |