Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211319 | Device structure | Chun-Jun Zhuang, Chen Yuan Weng | 2021-12-28 |
| 11195771 | Substrate structure of semiconductor device package and method of manufacturing the same | — | 2021-12-07 |
| 11139252 | Semiconductor package and method for manufacturing the same | Chun-Jun Zhuang, Yung-I Yeh | 2021-10-05 |
| 11139268 | Semiconductor package structure and method of manufacturing the same | — | 2021-10-05 |
| 11133284 | Semiconductor package device | Jen-Hsien Wong | 2021-09-28 |
| 10943843 | Semiconductor package structure | Hsiu-Chi Liu | 2021-03-09 |
| 10886223 | Semiconductor package | Chun-Jun Zhuang | 2021-01-05 |