Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11032911 | Embedded component package structure and manufacturing method thereof | Chien-Fan Chen | 2021-06-08 |
| 10950551 | Embedded component package structure and manufacturing method thereof | Yu-Ju Liao, Chien-Fan Chen | 2021-03-16 |