Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10980113 | Circuit board structure incorporated with resin-based conductive adhesive layer | Chih-Heng Chuo, Gwun-Jin Lin | 2021-04-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10980113 | Circuit board structure incorporated with resin-based conductive adhesive layer | Chih-Heng Chuo, Gwun-Jin Lin | 2021-04-13 |