WY

Wen-Bin Yang

TSMC: 1 patents #1,794 of 3,494Top 55%
Overall (2021): #214,329 of 548,734Top 40%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11133207 Method for forming films on wafers separated by different distances Feng-Yu CHEN, Jian-Lun Lo 2021-09-28