Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189556 | Manufacturing of a power semiconductor module | Chunlei Liu, Jürgen Schuderer | 2021-11-30 |
| 11018117 | Half-bridge module with coaxial arrangement of the DC terminals | Felix Traub, Jürgen Schuderer | 2021-05-25 |
| 10950516 | Resin encapsulated power semiconductor module with exposed terminal areas | — | 2021-03-16 |