Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11192782 | Method for preparing silicon wafer with rough surface and silicon wafer | Wooicheang Goh, Kahkeen Lai | 2021-12-07 |
| 11111134 | Method for processing conductive structure | Shaoquan Wang, Xiaohui Zhong, Kahkeen Lai, KianHeng Goh | 2021-09-07 |
| 10947110 | MEMS microphone and manufacturing method for making same | Shaoquan Wang, Xiaohui Zhong, Kahkeen Lai | 2021-03-16 |